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JUKI KE-2070 Pick and Place Machine High Speed LED PCB Production Line Machines SMD PCB Chip Mounter LED Making Machine
JUKI KE-2070 Pick and Place Machine Specification:
| Model | JUKI KE-2070 |
| Condition | Used |
| PCB thickness | 0.40 mm (min) -4 mm (max) |
| Applicable Component | 0402-50mm * 50mm (CHIP, SOT, SOP, MELF, QFP, CONNECTOR, PLCC) |
| Component height | 0.3mm-10.5mm. |
| Pin pitch (Min) | 0.4mm |
| Component Dimensions | 0.5mm * 1.0mm (Min), 23.5mm * 23.5mm (Max) |
| Mounting speed (Max) | 0.32 sec / CHIP, 1.8 / sec QFP) 8000 chip/ hour |
| Mounting accuracy | ± 0.1mm / chip (when laser recognition) ± 0.09mm / QFP (laser recognition) |
| Substrate size Min | 50 * 30mm |
| Substrate size Max | 410 * 360mm |
| Type of components | Max 20 * 20 mm, can be posted P 0.4 mm BGA and PLCC pin IC |
| Power | single-phase AC200V, 50HZ, 2.5KVA |
| Air pressure and air consumption | 0.5 ± 0.05Mpa, 150N1 / min |
| Dimensions | 1400 * 1300 * 1551 mm |
| Weight | 1150 kg |
The high-speed placement machine KE-2070 is suitable for high-speed placement of small and non-component chip placement machines and high-speed placement of small components.
Not only does the laser recognition component correspond to a wide range, but also with the MNVC option, it can perform high-precision image recognition of small IC components, supporting flexible production line configuration.
Chip components: 23,300CPH (laser recognition/best conditions) (0.155 seconds/chip) 18,300CPH (laser recognition/IPC9850)
IC components: 4,600CPH (image recognition / when using MNVC option)
Laser placement head×1 (6 nozzles)
0402 (English 01005) chip ~ 33.5mm square element
Image recognition (using MNVC option: reflective/transmissive recognition, ball recognition)
JUKI KE-2070 Pick and Place Machine picture show:
